Passivation of a Si(100) surface by S from solution

Abstract

A wet-chemical process has been developed to passivate the Si(100) surface with sulfur (S) in an aqueous solution. The solution contains an etchant for SiO2, ammonium hydroxide [NH4 OH] and a passivant for the surface, ammonium sulfide [(NH4) 2 S]. The compatibility of the etchant with the passivant allows SiO2, native or thermal, to be removed in situ from the surface. A fresh and clean Si(100) surface is exposed right before it is passivated by S. Schottky barrier heights of Al on S-passivated n- and p-type Si(100) show a greater sensitivity to Al work function and Si electron affinity, suggesting good-quality passivation. © 2007 The Electrochemical Society.

Publication Title

Electrochemical and Solid-State Letters

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